{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/10691497","patent":{"patent_number":"10691497","title":"HIGH BANDWIDTH CONNECTION BETWEEN PROCESSOR DIES","assignee":"Unknown","inventors":["Altug Koker","Abhishek R. Appu","Kiran C. Veernapu","Joydeep Ray","Balaji Vembu"],"filing_date":null,"publication_date":"2020-06-23T00:00:00.000Z","cpc_codes":[],"num_claims":null,"abstract":null},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"HIGH BANDWIDTH CONNECTION BETWEEN PROCESSOR DIES","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/10691497","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/10691497","citation_suggestion":"Patentable. \"HIGH BANDWIDTH CONNECTION BETWEEN PROCESSOR DIES\" (10691497). https://patentable.app/patents/10691497","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/10691497","json":"https://patentable.app/api/llm-context/10691497","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:24:28.867Z"}