{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/10854522","patent":{"patent_number":"10854522","title":"Method for Processing a Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative of at Least One Tip-to-Side Short or Leakage, at Least One Corner Short or Leakage, and at Least One Via Open or Resistance, Where Such Measurements Are Obtained from Non-Contact Pads Associated with Respective Tip-to-Side Short, Corner Short, and Via Open Test Areas","assignee":"Unknown","inventors":["Stephen Lam","Dennis Ciplickas","Tomasz Brozek","Jeremy Cheng","Simone Comensoli","Indranil De","Kelvin Doong","Hans Eisenmann","Timothy Fiscus","Jonathan Haigh","Christopher Hess","John Kibarian","Sherry Lee","Marci Liao","Sheng-Che Lin","Hideki Matsuhashi","Kimon Michaels","Conor O'Sullivan","Markus Rauscher","Vyacheslav Rovner","Andrzej Strojwas","Marcin Strojwas","Carl Taylor","Rakesh Vallishayee","Larg Weiland","Nobuharu Yokoyama"],"filing_date":null,"publication_date":"2020-12-01T00:00:00.000Z","cpc_codes":[],"num_claims":null,"abstract":null},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for Processing a Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative of at Least One Tip-to-Side Short or Leakage, at Least One Corner Short or Leakage, and at Least One Via Open or Resistance, Where Such Measurements Are Obtained from Non-Contact Pads Associated with Respective Tip-to-Side Short, Corner Short, and Via Open Test Areas","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/10854522","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/10854522","citation_suggestion":"Patentable. \"Method for Processing a Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative of at Least One Tip-to-Side Short or Leakage, at Least One Corner Short or Leakage, and at Least One Via Open or Resistance, Where Such Measurements Are Obtained from Non-Contact Pads Associated with Respective Tip-to-Side Short, Corner Short, and Via Open Test Areas\" (10854522). https://patentable.app/patents/10854522","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/10854522","json":"https://patentable.app/api/llm-context/10854522","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-29T20:38:08.624Z"}