{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10473604","patent":{"patent_number":"US-10473604","title":"Method of determining deformation location","assignee":null,"inventors":[],"filing_date":"2016-04-29T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["G01N","G01D","G01N","G01N","G01N"],"num_claims":16,"abstract":"A number of variations may involve a method that may include providing a non-conductive layer. A conductive layer may be provided overlying the non-conductive layer with the conductive layer to form a sensor device. An opposition to electrical current through the conductive layer may be monitored. The location of a status of the non-conductive layer or of the conductive layer may be determined through a change in the opposition."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of determining deformation location","description":"A number of variations may involve a method that may include providing a non-conductive layer. A conductive layer may be provided overlying the non-conductive layer with the conductive layer to form a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10473604","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10473604","citation_suggestion":"Patentable. \"Method of determining deformation location\" (US-10473604). https://patentable.app/patents/US-10473604","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10473604","json":"https://patentable.app/api/llm-context/US-10473604","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:09:47.768Z"}