{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10475178","patent":{"patent_number":"US-10475178","title":"System, method and computer program product for inspecting a wafer using a film thickness map generated for the wafer","assignee":null,"inventors":[],"filing_date":"2017-01-30T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["G06T","H01L","G06T","H01L"],"num_claims":17,"abstract":"A system, method, and computer program product are provided for inspecting a wafer using a film thickness map generated for the wafer. In use, a plurality of locations on a wafer are determined from a design of the wafer. Additionally, a measured brightness at each of the determined locations on the wafer is obtained. Further, a film thickness map for the wafer is generated from the obtained measurements. The wafer is then inspected using the film thickness map."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System, method and computer program product for inspecting a wafer using a film thickness map generated for the wafer","description":"A system, method, and computer program product are provided for inspecting a wafer using a film thickness map generated for the wafer. In use, a plurality of locations on a wafer are determined from a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10475178","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10475178","citation_suggestion":"Patentable. \"System, method and computer program product for inspecting a wafer using a film thickness map generated for the wafer\" (US-10475178). https://patentable.app/patents/US-10475178","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10475178","json":"https://patentable.app/api/llm-context/US-10475178","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:54:32.629Z"}