{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10475725","patent":{"patent_number":"US-10475725","title":"Structure to enable higher current density in integrated circuit resistor","assignee":null,"inventors":[],"filing_date":"2017-11-08T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"An integrated circuit has a substrate including semiconductor material and a resistor in an interconnect region, above a first level of interconnect lines. The integrated circuit further includes an electrically isolated thermal conduit having one or more interconnect lines in every interconnect level lower than the resistor. The interconnect lines of the thermal conduit are directly connected through one or more vertical interconnects, including contacts, and possibly vias, to a gate structure located on a dielectric material over the semiconductor material of the substrate. The thermal conduit is electrically isolated from the resistor, from all active components in the integrated circuit, and from the semiconductor material of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Structure to enable higher current density in integrated circuit resistor","description":"An integrated circuit has a substrate including semiconductor material and a resistor in an interconnect region, above a first level of interconnect lines. The integrated circuit further includes an e","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10475725","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10475725","citation_suggestion":"Patentable. \"Structure to enable higher current density in integrated circuit resistor\" (US-10475725). https://patentable.app/patents/US-10475725","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10475725","json":"https://patentable.app/api/llm-context/US-10475725","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:31:07.901Z"}