{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10475734","patent":{"patent_number":"US-10475734","title":"Semiconductor device package","assignee":null,"inventors":[],"filing_date":"2019-02-15T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device package includes: (1) a substrate having a first surface and a second surface opposite to the first surface; (2) a first patterned conductive layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first patterned conductive layer is adjacent to the substrate and opposite to the first surface of the first patterned conductive layer; (3) a first insulation layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first insulation layer is adjacent to the substrate and opposite to the first surface of the first insulation layer; and (4) a second patterned conductive layer extending from the first surface of the first insulation layer to the second surface of the substrate, the second patterned conductive layer electrically connected to the first patterned conductive layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package","description":"A semiconductor device package includes: (1) a substrate having a first surface and a second surface opposite to the first surface; (2) a first patterned conductive layer on the first surface of the s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10475734","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10475734","citation_suggestion":"Patentable. \"Semiconductor device package\" (US-10475734). https://patentable.app/patents/US-10475734","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10475734","json":"https://patentable.app/api/llm-context/US-10475734","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T17:21:34.913Z"}