{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10475749","patent":{"patent_number":"US-10475749","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2018-05-04T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package includes a first semiconductor chip on a first substrate, a first mold layer provided on the first substrate to cover a side surface of the first semiconductor chip, a solder structure provided on the first substrate, and a second substrate provided on the solder structure. A guide receptacle is formed at one of a top surface of the first mold layer and a bottom surface of the second substrate, a first alignment protrusion is formed at the other of the top surface of the first mold layer and the bottom surface of the second substrate, and at least a portion of the first alignment protrusion is provided in the guide receptacle."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package includes a first semiconductor chip on a first substrate, a first mold layer provided on the first substrate to cover a side surface of the first semiconductor chip, a solder s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10475749","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10475749","citation_suggestion":"Patentable. \"Semiconductor package\" (US-10475749). https://patentable.app/patents/US-10475749","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10475749","json":"https://patentable.app/api/llm-context/US-10475749","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T08:34:58.864Z"}