{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10475751","patent":{"patent_number":"US-10475751","title":"Fan-out semiconductor package","assignee":null,"inventors":[],"filing_date":"2018-08-31T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component disposed in the through-hole; an encapsulant encapsulating the core member and the electronic component; a metal plate disposed on an upper surface of the encapsulant; and a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other. The wall includes sections spaced apart from each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out semiconductor package","description":"A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component dispos","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10475751","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10475751","citation_suggestion":"Patentable. \"Fan-out semiconductor package\" (US-10475751). https://patentable.app/patents/US-10475751","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10475751","json":"https://patentable.app/api/llm-context/US-10475751","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T09:40:11.419Z"}