{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10475756","patent":{"patent_number":"US-10475756","title":"Composite antenna substrate and semiconductor package module","assignee":null,"inventors":[],"filing_date":"2018-12-12T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Composite antenna substrate and semiconductor package module","description":"A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semicondu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10475756","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10475756","citation_suggestion":"Patentable. \"Composite antenna substrate and semiconductor package module\" (US-10475756). https://patentable.app/patents/US-10475756","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10475756","json":"https://patentable.app/api/llm-context/US-10475756","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:51:38.468Z"}