{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10475769","patent":{"patent_number":"US-10475769","title":"Semiconductor package and manufacturing method of the same","assignee":null,"inventors":[],"filing_date":"2016-08-17T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides a semiconductor package, including a first semiconductor die layer having an active surface, a conductive contact electrically coupled to the active surface, a sidewall of the conductive contact being surrounded by an insulating layer, and a solder bump connected to the conductive contact. A seed layer is between the sidewall of the conductive contact and the insulating layer. The present disclosure provides a method for manufacturing a semiconductor package, the method including providing a carrier, forming an insulating layer over the carrier, debonding the carrier from the insulating layer, and exposing the conductive contact from the insulating layer by an etching operation."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method of the same","description":"The present disclosure provides a semiconductor package, including a first semiconductor die layer having an active surface, a conductive contact electrically coupled to the active surface, a sidewall","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10475769","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10475769","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method of the same\" (US-10475769). https://patentable.app/patents/US-10475769","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10475769","json":"https://patentable.app/api/llm-context/US-10475769","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:19:09.757Z"}