{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10477323","patent":{"patent_number":"US-10477323","title":"Microphone package","assignee":null,"inventors":[],"filing_date":"2018-08-03T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["H04R","H04R","H04R"],"num_claims":14,"abstract":"According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Microphone package","description":"According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device include","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10477323","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10477323","citation_suggestion":"Patentable. \"Microphone package\" (US-10477323). https://patentable.app/patents/US-10477323","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10477323","json":"https://patentable.app/api/llm-context/US-10477323","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:58:05.264Z"}