{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10477679","patent":{"patent_number":"US-10477679","title":"Method for producing wiring board","assignee":null,"inventors":[],"filing_date":"2018-01-08T00:00:00.000Z","publication_date":"2019-11-12T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F"],"num_claims":14,"abstract":"A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for producing wiring board","description":"A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpend","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10477679","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10477679","citation_suggestion":"Patentable. \"Method for producing wiring board\" (US-10477679). https://patentable.app/patents/US-10477679","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10477679","json":"https://patentable.app/api/llm-context/US-10477679","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:59:52.203Z"}