{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10479075","patent":{"patent_number":"US-10479075","title":"Print head substrate and method of manufacturing the same, and semiconductor substrate","assignee":null,"inventors":[],"filing_date":"2018-04-16T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A print head substrate includes: a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements, the substrate surface having an acute angle portion formed by the first side and a second side; and a test element group (TEG) area including a TEG not electrically connected to the printing elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Print head substrate and method of manufacturing the same, and semiconductor substrate","description":"A print head substrate includes: a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10479075","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10479075","citation_suggestion":"Patentable. \"Print head substrate and method of manufacturing the same, and semiconductor substrate\" (US-10479075). https://patentable.app/patents/US-10479075","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10479075","json":"https://patentable.app/api/llm-context/US-10479075","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:38:10.439Z"}