{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483148","patent":{"patent_number":"US-10483148","title":"Protective tape and method for manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-10-18T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A protective tape including an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer in this order to a surface of a wafer on which a bump electrode is formed; grinding a surface of the wafer opposite to the surface on which the protective tape is pasted; pasting an adhesive tape to the ground surface of the wafer; peeling the protective tape so that the adhesive agent layer remains and other layers are removed; dicing the wafer to which the adhesive tape is pasted to obtain individual semiconductor chips; and curing the adhesive agent layer before dicing; the adhesive agent layer after curing has a shear storage modulus of 3.0E+08 Pa to 5.0E+09 Pa, and the ratio of the thickness of the adhesive agent layer of the protective tape before pasting to the height of the bump electrode is 1/30 to 1/6."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Protective tape and method for manufacturing semiconductor device","description":"A protective tape including an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer in this order to a surface of a wafer on which a bump electrode is formed; grinding a surface ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483148","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483148","citation_suggestion":"Patentable. \"Protective tape and method for manufacturing semiconductor device\" (US-10483148). https://patentable.app/patents/US-10483148","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483148","json":"https://patentable.app/api/llm-context/US-10483148","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:57:36.948Z"}