{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483150","patent":{"patent_number":"US-10483150","title":"Apparatus for stacking semiconductor chips in a semiconductor package","assignee":null,"inventors":[],"filing_date":"2016-11-11T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Apparatus for stacking semiconductor chips in a semiconductor package","description":"An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483150","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483150","citation_suggestion":"Patentable. \"Apparatus for stacking semiconductor chips in a semiconductor package\" (US-10483150). https://patentable.app/patents/US-10483150","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483150","json":"https://patentable.app/api/llm-context/US-10483150","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:12:00.308Z"}