{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483173","patent":{"patent_number":"US-10483173","title":"Semiconductor device inspection method and semiconductor device manufacturing method","assignee":null,"inventors":[],"filing_date":"2018-07-10T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor device inspection method according to an embodiment includes irradiating a semiconductor chip or a metal member with first inspection light having a plurality of linear beams parallel to each other from a first direction inclining with respect to a top surface of a substrate, the semiconductor chip being disposed on the substrate, and the metal member being disposed on the semiconductor chip; obtaining a first image of the semiconductor chip irradiated with the first inspection light or the metal member irradiated with the first inspection light; and calculating first three-dimensional information of the semiconductor chip or the metal member based on the first image by using an optical cutting method."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device inspection method and semiconductor device manufacturing method","description":"A semiconductor device inspection method according to an embodiment includes irradiating a semiconductor chip or a metal member with first inspection light having a plurality of linear beams parallel ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483173","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483173","citation_suggestion":"Patentable. \"Semiconductor device inspection method and semiconductor device manufacturing method\" (US-10483173). https://patentable.app/patents/US-10483173","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483173","json":"https://patentable.app/api/llm-context/US-10483173","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:08:58.835Z"}