{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483176","patent":{"patent_number":"US-10483176","title":"Semiconductor module","assignee":null,"inventors":[],"filing_date":"2015-12-04T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"Provided is a semiconductor module in which a case and a base plate joined together with a simple structure, the semiconductor module having high insulation strength. The semiconductor module includes the following: a base plate; at least one semiconductor chip disposed inside the base plate other than the outer periphery of the base plate and above the base plate; and a case joined to the outer periphery of the base plate with an adhesive, and containing the at least one semiconductor chip. The upper surface of the base plate is provided with a recess or a protrusion between an inner wall of the case and the at least one semiconductor chip in a plan view."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor module","description":"Provided is a semiconductor module in which a case and a base plate joined together with a simple structure, the semiconductor module having high insulation strength. The semiconductor module includes","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483176","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483176","citation_suggestion":"Patentable. \"Semiconductor module\" (US-10483176). https://patentable.app/patents/US-10483176","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483176","json":"https://patentable.app/api/llm-context/US-10483176","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:13:24.510Z"}