{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483180","patent":{"patent_number":"US-10483180","title":"Process for the wafer-scale fabrication of hermetic electronic modules","assignee":null,"inventors":[],"filing_date":"2017-12-01T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Process for the wafer-scale fabrication of hermetic electronic modules","description":"An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483180","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483180","citation_suggestion":"Patentable. \"Process for the wafer-scale fabrication of hermetic electronic modules\" (US-10483180). https://patentable.app/patents/US-10483180","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483180","json":"https://patentable.app/api/llm-context/US-10483180","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:30:54.495Z"}