{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483202","patent":{"patent_number":"US-10483202","title":"Semiconductor device having a wiring line with an end portion having rounded side surfaces and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2016-09-02T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor device includes a first to a third wiring-line. The first wiring-line is provided on a first layer in a first direction. The second wiring-line is provided on the first layer in the first direction. A first side surface of the second wiring-line faces the first wiring-line. A second side surface of the second wiring-line is opposite to the first side surface. The third wiring-line is provided on the first layer in the first direction, and faces the second side surface of the second wiring-line. An end portion of the first wiring-line projects further from an end portion of the second wiring-line in the first direction. The end portion of the second wiring-line projects further from an end portion of the third wiring-line in the first direction, and curves toward the third wiring-line. Alternatively, the end portion of the second wiring-line increases in width toward its edge portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having a wiring line with an end portion having rounded side surfaces and manufacturing method thereof","description":"A semiconductor device includes a first to a third wiring-line. The first wiring-line is provided on a first layer in a first direction. The second wiring-line is provided on the first layer in the fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483202","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483202","citation_suggestion":"Patentable. \"Semiconductor device having a wiring line with an end portion having rounded side surfaces and manufacturing method thereof\" (US-10483202). https://patentable.app/patents/US-10483202","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483202","json":"https://patentable.app/api/llm-context/US-10483202","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T12:44:16.942Z"}