{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483211","patent":{"patent_number":"US-10483211","title":"Fan-out package structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2017-01-30T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":28,"abstract":"A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first redistribution layer (RDL) structure having a first surface and a second surface opposite thereto. A first semiconductor die is disposed on and electrically coupled to the first surface of the first RDL structure. A first molding compound is disposed on the first surface of the first RDL structure and surrounds the first semiconductor die. A plurality of solder balls or conductive pillar structures is disposed in the first molding compound and electrically coupled to the first semiconductor die through the first RDL structure. A method for forming the semiconductor package is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out package structure and method for forming the same","description":"A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first redistribution layer (RDL) structure having a first surface and ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483211","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483211","citation_suggestion":"Patentable. \"Fan-out package structure and method for forming the same\" (US-10483211). https://patentable.app/patents/US-10483211","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483211","json":"https://patentable.app/api/llm-context/US-10483211","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:38:58.379Z"}