{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483216","patent":{"patent_number":"US-10483216","title":"Power module and fabrication method for the same","assignee":null,"inventors":[],"filing_date":"2016-12-07T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The power module includes: a ceramics substrate; a source electrode pattern, a drain electrode pattern, a source signal electrode pattern, and a gate signal electrode pattern respectively disposed on the ceramics substrate; a semiconductor device disposed on the drain electrode pattern, the semiconductor device comprising a source pad electrode and a gate pad electrode at a front surface side; a divided leadframe for source bonded to the source electrode pattern and the source pad electrode; and a divided leadframe for gate pad electrode bonded to a gate pad electrode. There is provided a power module having a simplified structure, fabricated through a simplified process, and capable of conducting a large current; and a fabrication method for such a power module."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power module and fabrication method for the same","description":"The power module includes: a ceramics substrate; a source electrode pattern, a drain electrode pattern, a source signal electrode pattern, and a gate signal electrode pattern respectively disposed on ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483216","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483216","citation_suggestion":"Patentable. \"Power module and fabrication method for the same\" (US-10483216). https://patentable.app/patents/US-10483216","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483216","json":"https://patentable.app/api/llm-context/US-10483216","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:24:39.385Z"}