{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483218","patent":{"patent_number":"US-10483218","title":"Integrated circuit (IC) devices with varying diameter via layer","assignee":null,"inventors":[],"filing_date":"2019-05-31T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit (IC) device that includes an IC device layer, at least one electrical connection layer located over the IC device layer, and a varying diameter via layer located over the at least one electrical connection layer. The varying diameter via layer includes (i) an interior region having a plurality of interior region vias and (ii) a perimeter region having a plurality of perimeter region vias. The plurality of interior region vias of the interior region is larger than the plurality of perimeter region vias of the perimeter region. The varying diameter via layer comprises an interior surface that is coupled to an interior surface of the at least one electrical connection layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit (IC) devices with varying diameter via layer","description":"An integrated circuit (IC) device that includes an IC device layer, at least one electrical connection layer located over the IC device layer, and a varying diameter via layer located over the at leas","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483218","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483218","citation_suggestion":"Patentable. \"Integrated circuit (IC) devices with varying diameter via layer\" (US-10483218). https://patentable.app/patents/US-10483218","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483218","json":"https://patentable.app/api/llm-context/US-10483218","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:37:54.080Z"}