{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483223","patent":{"patent_number":"US-10483223","title":"Semiconductor device having a large area interconnect or pad","assignee":null,"inventors":[],"filing_date":"2017-08-09T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A slit is formed along a coupling portion at which a second interconnect is connected to a relatively large area interconnect or pad. Since tensile stress of a resist that is caused due to baking, UV curing, or other treatments in photolithography can be dispersed, contraction and deformation of the resist at an end of the second interconnect can be alleviated, and dimensions and shape of a interconnect, which is formed by etching, can be stabilized."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having a large area interconnect or pad","description":"A slit is formed along a coupling portion at which a second interconnect is connected to a relatively large area interconnect or pad. Since tensile stress of a resist that is caused due to baking, UV ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483223","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483223","citation_suggestion":"Patentable. \"Semiconductor device having a large area interconnect or pad\" (US-10483223). https://patentable.app/patents/US-10483223","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483223","json":"https://patentable.app/api/llm-context/US-10483223","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:18:41.823Z"}