{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483233","patent":{"patent_number":"US-10483233","title":"Split ball grid array pad for multi-chip modules","assignee":null,"inventors":[],"filing_date":"2017-01-26T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Split ball grid array pad for multi-chip modules","description":"A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surfac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483233","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483233","citation_suggestion":"Patentable. \"Split ball grid array pad for multi-chip modules\" (US-10483233). https://patentable.app/patents/US-10483233","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483233","json":"https://patentable.app/api/llm-context/US-10483233","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:35:37.962Z"}