{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483250","patent":{"patent_number":"US-10483250","title":"Three-dimensional small form factor system in package architecture","assignee":null,"inventors":[],"filing_date":"2015-11-04T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"Embodiments are generally directed to three-dimensional small form factor system in package architecture. An embodiment of an apparatus includes a first package having a first side and an opposite second side, the first package including a plurality of embedded electronic components and one or more embedded via bars, each via bar including a plurality of through vias; and a second package having a first side and an opposite second side, the second package including a plurality of embedded electronic components, wherein a first side of the first package and a second side of second package are coupled together by a plurality of connections, including at least a first connection connecting the second package to a first component of the first package and a second connection connecting the second package to a first via bar of the one or more via bars."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Three-dimensional small form factor system in package architecture","description":"Embodiments are generally directed to three-dimensional small form factor system in package architecture. An embodiment of an apparatus includes a first package having a first side and an opposite sec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483250","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483250","citation_suggestion":"Patentable. \"Three-dimensional small form factor system in package architecture\" (US-10483250). https://patentable.app/patents/US-10483250","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483250","json":"https://patentable.app/api/llm-context/US-10483250","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:20:26.987Z"}