{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10483254","patent":{"patent_number":"US-10483254","title":"Electronic module and semiconductor package device","assignee":null,"inventors":[],"filing_date":"2017-01-17T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first electrode. The second sub-module includes a second substrate, a second electronic component disposed on the second substrate and a second electrode spaced from the first electrode. The second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic module and semiconductor package device","description":"An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first elec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10483254","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10483254","citation_suggestion":"Patentable. \"Electronic module and semiconductor package device\" (US-10483254). https://patentable.app/patents/US-10483254","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10483254","json":"https://patentable.app/api/llm-context/US-10483254","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:24:23.556Z"}