{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10484025","patent":{"patent_number":"US-10484025","title":"Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers","assignee":null,"inventors":[],"filing_date":"2017-07-27T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H04B","H01L","H01L","H01L","H01L","H01L","H01L","H04B","H04B","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H04B","H04B"],"num_claims":24,"abstract":"An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operating frequency region with a first transmit and receive chain, and a second operating frequency region with a second transmit chain and a second receive chain. There is a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second operating frequency region with a shared power supply input conductive pad connected to the first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power detection output conductive pad connected to the first transmit chain and the second transmit chain."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers","description":"An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operati","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10484025","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10484025","citation_suggestion":"Patentable. \"Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers\" (US-10484025). https://patentable.app/patents/US-10484025","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10484025","json":"https://patentable.app/api/llm-context/US-10484025","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:53:36.704Z"}