{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10485098","patent":{"patent_number":"US-10485098","title":"Electronic component device","assignee":null,"inventors":[],"filing_date":"2016-06-16T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"An electronic component device includes: a wiring board including an insulating layer, and a plurality of pads exposed from the insulating layer; an electronic component module including: an insulating base material; an electronic component embedded in the insulating base material; and a plurality of connection terminals each connected to a corresponding one of the pads; and a sealing resin provided between the whole of a lower surface of the electronic component module id the wiring board. A content rate of filler contained in the sealing resin is higher than that of filler contained in the insulating layer and that of filler contained in the insulating base material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component device","description":"An electronic component device includes: a wiring board including an insulating layer, and a plurality of pads exposed from the insulating layer; an electronic component module including: an insulatin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10485098","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10485098","citation_suggestion":"Patentable. \"Electronic component device\" (US-10485098). https://patentable.app/patents/US-10485098","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10485098","json":"https://patentable.app/api/llm-context/US-10485098","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:06:30.220Z"}