{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10485139","patent":{"patent_number":"US-10485139","title":"Power module, thermal dissipation structure of the power module and contact method of the power module","assignee":null,"inventors":[],"filing_date":"2018-01-31T00:00:00.000Z","publication_date":"2019-11-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":26,"abstract":"The power module in which a plurality of switching elements connected in series between a first and second power terminals and a circuit configured to connect connecting points thereof to an output terminal are formed, the power module includes: a heat sink to which the switching elements are contacted; a package configured to seal a perimeter of the plurality of switching elements and a part of each terminal so as to expose at least one portion of the heat sink; and a protruding portion for thickness control configured to regulate a thickness of a thermally-conductive material when contacting the heat sink to the cooling apparatus facing the cooling apparatus via the thermally-conductive material, wherein each terminal is exposed from opposite side surfaces of the package, the opposite side surfaces having a height different from a height of an exposed surface of the cooling apparatus of the package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power module, thermal dissipation structure of the power module and contact method of the power module","description":"The power module in which a plurality of switching elements connected in series between a first and second power terminals and a circuit configured to connect connecting points thereof to an output te","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10485139","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10485139","citation_suggestion":"Patentable. \"Power module, thermal dissipation structure of the power module and contact method of the power module\" (US-10485139). https://patentable.app/patents/US-10485139","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10485139","json":"https://patentable.app/api/llm-context/US-10485139","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:06:19.823Z"}