{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10490415","patent":{"patent_number":"US-10490415","title":"Method of manufacturing 3-dimensional memories including high aspect ratio memory hole patterns","assignee":null,"inventors":[],"filing_date":"2016-08-31T00:00:00.000Z","publication_date":"2019-11-26T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":8,"abstract":"According to one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes forming a second film on the first film. The method further includes simultaneously flowing a first gas with a second gas containing a metal element to form a first opening in the second film and forming a third film containing the metal element on a side surface of the first opening. The method further includes forming a second opening in the first film below the first opening using the second film as a mask."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing 3-dimensional memories including high aspect ratio memory hole patterns","description":"According to one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes forming a second film on the first film. The met","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10490415","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10490415","citation_suggestion":"Patentable. \"Method of manufacturing 3-dimensional memories including high aspect ratio memory hole patterns\" (US-10490415). https://patentable.app/patents/US-10490415","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10490415","json":"https://patentable.app/api/llm-context/US-10490415","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:38:29.067Z"}