{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10490479","patent":{"patent_number":"US-10490479","title":"Packaging of semiconductor device with antenna and heat spreader","assignee":null,"inventors":[],"filing_date":"2018-06-25T00:00:00.000Z","publication_date":"2019-11-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes an integrated circuit (IC), a heat dissipation structure, a molding layer and an antenna. The IC is mounted on a first surface of a first redistribution layer (RDL). The heat dissipation structure is mounted on a second surface of the first RDL. The molding compound is disposed over the first surface of the first RDL. The antenna is disposed on the second surface of the first RDL, wherein the antenna is disposed side-by-side to the heat dissipation structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging of semiconductor device with antenna and heat spreader","description":"A semiconductor package includes an integrated circuit (IC), a heat dissipation structure, a molding layer and an antenna. The IC is mounted on a first surface of a first redistribution layer (RDL). T","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10490479","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10490479","citation_suggestion":"Patentable. \"Packaging of semiconductor device with antenna and heat spreader\" (US-10490479). https://patentable.app/patents/US-10490479","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10490479","json":"https://patentable.app/api/llm-context/US-10490479","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:31:02.828Z"}