{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10490490","patent":{"patent_number":"US-10490490","title":"Thermally conductive semiconductor device and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2016-03-11T00:00:00.000Z","publication_date":"2019-11-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor device of the present invention includes: a plurality of wiring boards disposed separately from one another; a plurality of semiconductor elements disposed on first main surfaces of the wiring boards and electrically connected to the wiring boards; a plurality of terminals electrically connected to the wiring boards; a sealing resin sealing the wiring boards and the semiconductor elements so that second main surfaces of the wiring boards are exposed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermally conductive semiconductor device and manufacturing method thereof","description":"A semiconductor device of the present invention includes: a plurality of wiring boards disposed separately from one another; a plurality of semiconductor elements disposed on first main surfaces of th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10490490","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10490490","citation_suggestion":"Patentable. \"Thermally conductive semiconductor device and manufacturing method thereof\" (US-10490490). https://patentable.app/patents/US-10490490","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10490490","json":"https://patentable.app/api/llm-context/US-10490490","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:31:05.676Z"}