{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10490509","patent":{"patent_number":"US-10490509","title":"Substrate having power delivery network for reducing electromagnetic interference and devices including the substrate","assignee":null,"inventors":[],"filing_date":"2016-11-29T00:00:00.000Z","publication_date":"2019-11-26T00:00:00.000Z","cpc_codes":["H01L","G09G","H01L","H01L","H01L","H01L","G09G","G09G","G09G","G09G","G09G","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor package includes an integrated circuit mounted on a substrate, a first power line disposed on or above the substrate and configured to transmit an operating voltage to the integrated circuit, and a second power line disposed on or above the substrate and configured to transmit a ground voltage to the integrated circuit, in which each of the first power line and the second power line has a first width, the first power line is spaced apart from the second power line by a first distance, thicknesses of each of the first power line and the second power line are less than or equal to 20 μm, and a ratio of the first width to the first distance is greater than 2.5."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate having power delivery network for reducing electromagnetic interference and devices including the substrate","description":"A semiconductor package includes an integrated circuit mounted on a substrate, a first power line disposed on or above the substrate and configured to transmit an operating voltage to the integrated c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10490509","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10490509","citation_suggestion":"Patentable. \"Substrate having power delivery network for reducing electromagnetic interference and devices including the substrate\" (US-10490509). https://patentable.app/patents/US-10490509","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10490509","json":"https://patentable.app/api/llm-context/US-10490509","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:57:59.082Z"}