{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10496594","patent":{"patent_number":"US-10496594","title":"Inter-processor communication method for access latency between system-in-package (SIP) dies","assignee":null,"inventors":[],"filing_date":"2018-06-01T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F","G06F","G06F","G11C","G11C","G06F"],"num_claims":17,"abstract":"A system and method wherein die-to-die communication are provided between a first die and a second die contained in a common integrated circuit (IC) package, a first processor on the first die communicatively coupled to the first connectivity circuitry by the first processor bus and configured to provide first bus transactions, to be provided to the second connectivity circuitry, to the first processor bus, the first connectivity circuitry configured to utilize a multiple simultaneous outstanding transaction capability supporting multiple simultaneous outstanding write transactions concurrent with multiple simultaneous outstanding read transactions, the second connectivity circuitry configured to provide processor bus flow control information and elasticity buffer status information pertaining to the elasticity buffer to the first connectivity circuitry via a common message for flow control."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Inter-processor communication method for access latency between system-in-package (SIP) dies","description":"A system and method wherein die-to-die communication are provided between a first die and a second die contained in a common integrated circuit (IC) package, a first processor on the first die communi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10496594","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10496594","citation_suggestion":"Patentable. \"Inter-processor communication method for access latency between system-in-package (SIP) dies\" (US-10496594). https://patentable.app/patents/US-10496594","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10496594","json":"https://patentable.app/api/llm-context/US-10496594","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:17:30.915Z"}