{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497623","patent":{"patent_number":"US-10497623","title":"Method of manufacturing a semiconductor package including a shield layer","assignee":null,"inventors":[],"filing_date":"2018-04-20T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor package has a semiconductor chip on a wiring board, sealed with a sealant. A semiconductor package substrate is formed with V grooves along division lines from a resin layer side by use of a V blade. The wiring board is divided along the V grooves into individual semiconductor packages, while forming an inclined surface and a vertical surface at each package side surface. A shield layer is formed on the package upper surface and the package side surfaces. In this instance, the aspect ratio at the vertical surface side of the package interval is controlled, whereby an appropriate shield layer is formed on the package upper surface and the package inclined surfaces, thereby securing a shielding effect, and the shield layer is formed in a thin form on the package vertical surfaces and on the groove bottom between the packages, thereby restraining generation of burs."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing a semiconductor package including a shield layer","description":"A semiconductor package has a semiconductor chip on a wiring board, sealed with a sealant. A semiconductor package substrate is formed with V grooves along division lines from a resin layer side by us","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497623","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497623","citation_suggestion":"Patentable. \"Method of manufacturing a semiconductor package including a shield layer\" (US-10497623). https://patentable.app/patents/US-10497623","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497623","json":"https://patentable.app/api/llm-context/US-10497623","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:01:39.174Z"}