{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497643","patent":{"patent_number":"US-10497643","title":"Patterned die pad for packaged vertical semiconductor devices","assignee":null,"inventors":[],"filing_date":"2018-05-08T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A method of semiconductor device packaging to form a packaged semiconductor device includes providing (i) a vertical power semiconductor device die including a semiconductor substrate including a control node, a source or emitter on a top side or on a bottom side of the substrate, and a drain or a collector on another of the top side the bottom side, a backside metal (BSM) layer on the bottom side, and (ii) a leadframe. The leadframe includes a patterned die pad that includes a common continuous base portion and a two-dimensional array of spaced apart posts extending up from the base portion, with a separate solder cap on a top of the posts. The BSM layer is placed on the solder caps, and reflow processing bonds the BSM layer to the solder caps."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Patterned die pad for packaged vertical semiconductor devices","description":"A method of semiconductor device packaging to form a packaged semiconductor device includes providing (i) a vertical power semiconductor device die including a semiconductor substrate including a cont","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497643","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497643","citation_suggestion":"Patentable. \"Patterned die pad for packaged vertical semiconductor devices\" (US-10497643). https://patentable.app/patents/US-10497643","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497643","json":"https://patentable.app/api/llm-context/US-10497643","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:15:33.340Z"}