{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497648","patent":{"patent_number":"US-10497648","title":"Embedded electronics package with multi-thickness interconnect structure and method of making same","assignee":null,"inventors":[],"filing_date":"2018-04-03T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":33,"abstract":"An embedded electronics package and method of manufacture includes a support substrate, a power semiconductor component coupled to a first side of the support substrate, and a logic semiconductor component coupled to a second side of the support substrate, opposite the first side. A first insulating material surrounds the logic semiconductor component. A logic interconnect layer is electrically coupled to the logic semiconductor component by at least one conductive micro-via extending through a portion of the first insulating material. A power interconnect layer is electrically coupled to the power semiconductor component by at least one conductive macro-via extending through a thickness of the support substrate. The power interconnect layer is thicker than the logic interconnect layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Embedded electronics package with multi-thickness interconnect structure and method of making same","description":"An embedded electronics package and method of manufacture includes a support substrate, a power semiconductor component coupled to a first side of the support substrate, and a logic semiconductor comp","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497648","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497648","citation_suggestion":"Patentable. \"Embedded electronics package with multi-thickness interconnect structure and method of making same\" (US-10497648). https://patentable.app/patents/US-10497648","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497648","json":"https://patentable.app/api/llm-context/US-10497648","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:20:04.418Z"}