{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497655","patent":{"patent_number":"US-10497655","title":"Methods, circuits and systems for a package structure having wireless lateral connections","assignee":null,"inventors":[],"filing_date":"2018-02-06T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A packaged semiconductor device includes an insulating material forming a side surface of the packaged semiconductor device. An integrated-circuit chip is embedded in the insulating material and includes a communication circuit. A wiring system is embedded in the insulating material and electrically couples the integrated-circuit chip with a plurality of package contact elements. A first communication pad is formed in the side surface and is operatively coupled to the communication circuit to enable signal exchange through the first communication pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods, circuits and systems for a package structure having wireless lateral connections","description":"A packaged semiconductor device includes an insulating material forming a side surface of the packaged semiconductor device. An integrated-circuit chip is embedded in the insulating material and inclu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497655","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497655","citation_suggestion":"Patentable. \"Methods, circuits and systems for a package structure having wireless lateral connections\" (US-10497655). https://patentable.app/patents/US-10497655","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497655","json":"https://patentable.app/api/llm-context/US-10497655","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T08:37:08.919Z"}