{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497662","patent":{"patent_number":"US-10497662","title":"Semiconductor device and ball bonder","assignee":null,"inventors":[],"filing_date":"2018-01-24T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"In order to inhibit forming cracks under a pad opening during ball bonding without increasing a chip size, a protective film includes a pad opening that exposes a part of a topmost layer metal film of the chip. A second metal film provided under the pad opening has a ring shape that defines a rectangular opening under the pad opening. The opening edge of the opening in the second metal film extends inwardly beyond the edge of the overlying pad opening. Vias connect the second metal film and the topmost layer metal film, and all of these vias are located outside the pad opening in plan view."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and ball bonder","description":"In order to inhibit forming cracks under a pad opening during ball bonding without increasing a chip size, a protective film includes a pad opening that exposes a part of a topmost layer metal film of","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497662","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497662","citation_suggestion":"Patentable. \"Semiconductor device and ball bonder\" (US-10497662). https://patentable.app/patents/US-10497662","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497662","json":"https://patentable.app/api/llm-context/US-10497662","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:06:11.832Z"}