{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497664","patent":{"patent_number":"US-10497664","title":"Wire bonded electronic devices to round wire","assignee":null,"inventors":[],"filing_date":"2017-01-05T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["G06K","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A disclosed circuit arrangement includes adhesive transfer tape, and an electronic device attached to adhesive of the adhesive transfer tape. First and second cross wires are attached to the adhesive and are disposed proximate the electronic device. One or more wire segments are attached to the adhesive and have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments have round cross sections, the first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. First and second bond wires are connected to the electronic device and to the first and second portions of the one or more wire segments, respectively."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wire bonded electronic devices to round wire","description":"A disclosed circuit arrangement includes adhesive transfer tape, and an electronic device attached to adhesive of the adhesive transfer tape. First and second cross wires are attached to the adhesive ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497664","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497664","citation_suggestion":"Patentable. \"Wire bonded electronic devices to round wire\" (US-10497664). https://patentable.app/patents/US-10497664","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497664","json":"https://patentable.app/api/llm-context/US-10497664","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:30:53.196Z"}