{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497675","patent":{"patent_number":"US-10497675","title":"Semiconductor device including multiple semiconductor chips","assignee":null,"inventors":[],"filing_date":"2016-10-21T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"There is provided a semiconductor device, enhanced with process capability and reliability by way of flow control of an adhesive material to fix semiconductor chips. The semiconductor device includes a first semiconductor chip including a first surface and a second surface opposite to each other, a flow regulating structure formed at the first surface of the first semiconductor chip, and a second semiconductor chip mounted on the first surface of the first semiconductor chip. The second semiconductor chip overlaps at least a portion of the flow regulating structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including multiple semiconductor chips","description":"There is provided a semiconductor device, enhanced with process capability and reliability by way of flow control of an adhesive material to fix semiconductor chips. The semiconductor device includes ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497675","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497675","citation_suggestion":"Patentable. \"Semiconductor device including multiple semiconductor chips\" (US-10497675). https://patentable.app/patents/US-10497675","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497675","json":"https://patentable.app/api/llm-context/US-10497675","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:33:11.378Z"}