{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10497691","patent":{"patent_number":"US-10497691","title":"Methods of stacking semiconductor dies","assignee":null,"inventors":[],"filing_date":"2018-11-09T00:00:00.000Z","publication_date":"2019-12-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of stacking semiconductor dies includes attaching a lower semiconductor die to a base substrate with an adhesive layer and attaching an upper semiconductor die to the lower semiconductor die with another adhesive layer. A thermo-compression bonding technique is applied to the upper semiconductor die to cure the adhesive layers and to bond the upper semiconductor die to the lower semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of stacking semiconductor dies","description":"A method of stacking semiconductor dies includes attaching a lower semiconductor die to a base substrate with an adhesive layer and attaching an upper semiconductor die to the lower semiconductor die ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10497691","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10497691","citation_suggestion":"Patentable. \"Methods of stacking semiconductor dies\" (US-10497691). https://patentable.app/patents/US-10497691","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10497691","json":"https://patentable.app/api/llm-context/US-10497691","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T08:44:02.779Z"}