{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10500693","patent":{"patent_number":"US-10500693","title":"Run-to-run control for chemical mechanical planarization","assignee":null,"inventors":[],"filing_date":"2012-04-05T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":5,"abstract":"A method for fabricating an integrated circuit includes providing a partitioned chemical-mechanical planarization (CMP) model having a plurality of model parameters that include (i) device specific model parameters and (ii) at least one common parameter. (i) include a pre-CMP thickness of a film including a first material on an in-process device, a post-CMP target thickness for the film on the in-process device, and device group properties that account for device structure for the in-process device. (ii) includes a polish rate from an unpatterned pilot wafer having a second material thereon. The second material need not be the same as the first material. The polish time is automatically determined using the partitioned CMP model. A CMP process is performed on a patterned product wafer having a plurality of the in-process devices using a recipe including the polish time."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Run-to-run control for chemical mechanical planarization","description":"A method for fabricating an integrated circuit includes providing a partitioned chemical-mechanical planarization (CMP) model having a plurality of model parameters that include (i) device specific mo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10500693","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10500693","citation_suggestion":"Patentable. \"Run-to-run control for chemical mechanical planarization\" (US-10500693). https://patentable.app/patents/US-10500693","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10500693","json":"https://patentable.app/api/llm-context/US-10500693","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:22:41.450Z"}