{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10501664","patent":{"patent_number":"US-10501664","title":"Resin compositon, removable adhesive layer, IC substrate, and IC packaging process","assignee":null,"inventors":[],"filing_date":"2018-09-12T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Resin compositon, removable adhesive layer, IC substrate, and IC packaging process","description":"A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule parti","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10501664","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10501664","citation_suggestion":"Patentable. \"Resin compositon, removable adhesive layer, IC substrate, and IC packaging process\" (US-10501664). https://patentable.app/patents/US-10501664","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10501664","json":"https://patentable.app/api/llm-context/US-10501664","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:34:50.395Z"}