{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504819","patent":{"patent_number":"US-10504819","title":"Integrated circuit package with enhanced cooling structure","assignee":null,"inventors":[],"filing_date":"2015-11-11T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","G01N","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit package may include an integrated circuit die having first and second circuit regions and a surface. The first circuit region of the integrated circuit package has an operating temperature that is different than that of the second circuit region. A cooling structure is formed on the surface of the integrated circuit die. The cooling structure includes a group of micropipe interconnects arranged to form a cooling channel that allows for the flow of coolant. The cooling channel includes first and second sub-channels. The first sub-channel has a first size that allows a higher flow rate of the coolant to cool the first circuit region. The second sub-channel has a second size that allows a lower flow rate of the coolant to cool the second circuit region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package with enhanced cooling structure","description":"An integrated circuit package may include an integrated circuit die having first and second circuit regions and a surface. The first circuit region of the integrated circuit package has an operating t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504819","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504819","citation_suggestion":"Patentable. \"Integrated circuit package with enhanced cooling structure\" (US-10504819). https://patentable.app/patents/US-10504819","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504819","json":"https://patentable.app/api/llm-context/US-10504819","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:54:53.023Z"}