{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504820","patent":{"patent_number":"US-10504820","title":"Semiconductor module and electric power conversion device","assignee":null,"inventors":[],"filing_date":"2016-10-21T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H02M","H02M","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A plurality of semiconductor devices (4a-4f, 5a-5f) are provided on an upper surface of the conductive base plate (1) via an insulating substrate (2) and a conductive pattern (3a-3d). A plurality of fins (6) are provided on a lower surface of the conductive base plate (1). A heat dissipating base plate (7) is provided to tips of the plurality of fins (6). A cooler (8) having an inflow port (9a) and an outflow port (9b) in a bottom surface surrounds the plurality of fins (6) and the heat dissipating base plate (7). A partition (10) separates a space surrounded by the cooler (8) and the heat dissipating base plate (7) into an inflow-side space (11a) connected to the inflow port (9a) and an outflow-side space (11b) connected to the outflow port (9b). A first slit (12a) is provided in a central portion of the heat dissipating base plate (7). Second and third slits (12b,12c) are respectively provided on both sides of the heat dissipating base plate (7) along a direction from an inflow side to an outflow side. One of the first slit (12a) and the second and third slits (12b,12c) is an inflow-side slit connected to the inflow-side space (11a) and the other is an outflow-side slit connected to the outflow-side space (11b)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor module and electric power conversion device","description":"A plurality of semiconductor devices (4a-4f, 5a-5f) are provided on an upper surface of the conductive base plate (1) via an insulating substrate (2) and a conductive pattern (3a-3d). A plurality of f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504820","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504820","citation_suggestion":"Patentable. \"Semiconductor module and electric power conversion device\" (US-10504820). https://patentable.app/patents/US-10504820","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504820","json":"https://patentable.app/api/llm-context/US-10504820","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:08:07.693Z"}