{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504826","patent":{"patent_number":"US-10504826","title":"Device almost last embedded device structure and method of manufacturing thereof","assignee":null,"inventors":[],"filing_date":"2018-10-08T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":36,"abstract":"An electronics package is disclosed that comprises a multilayer interconnect structure including a plurality of insulating substrate layers each having a plurality of microvias formed therein, a plurality of conductive wiring layers positioned on the plurality of insulating substrate layers, and a plurality of conductive microvias in the plurality of microvias to, wherein a bottom wiring layer includes a plurality of first terminal pads that are positioned on a bottom surface of the multilayer interconnect structure. The electronics package also comprises an electrical component coupled to the bottom surface of the multilayer interconnect structure, the electrical component including first I/O pads aligned with the first terminal pads and second I/O pads aligned to regions of the multilayer interconnect structure without first terminal pads. The electronics package further comprises a plurality of conductive through vias extending through the multilayer interconnect structure and electrically connected to the plurality of second I/O pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Device almost last embedded device structure and method of manufacturing thereof","description":"An electronics package is disclosed that comprises a multilayer interconnect structure including a plurality of insulating substrate layers each having a plurality of microvias formed therein, a plura","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504826","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504826","citation_suggestion":"Patentable. \"Device almost last embedded device structure and method of manufacturing thereof\" (US-10504826). https://patentable.app/patents/US-10504826","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504826","json":"https://patentable.app/api/llm-context/US-10504826","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T10:39:49.676Z"}