{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504829","patent":{"patent_number":"US-10504829","title":"Semiconductor package and semiconductor module including the same","assignee":null,"inventors":[],"filing_date":"2018-08-07T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a substrate having a top surface on which a semiconductor chip is mounted and a bottom surface opposite the top surface, an upper metal pattern including an upper connection region to which an external electrical device is connected and a chip connection region to which the semiconductor chip is connected, a lower metal pattern including a lower connection region to which other external electrical device is connected, and an intermediate metal pattern electrically connecting the upper and lower metal patterns. The upper metal pattern provides at least three groups of inner leads. The lower metal pattern provides at least three groups of outer leads. A module, such as that of a display device, may include the semiconductor package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and semiconductor module including the same","description":"A semiconductor package includes a substrate having a top surface on which a semiconductor chip is mounted and a bottom surface opposite the top surface, an upper metal pattern including an upper conn","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504829","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504829","citation_suggestion":"Patentable. \"Semiconductor package and semiconductor module including the same\" (US-10504829). https://patentable.app/patents/US-10504829","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504829","json":"https://patentable.app/api/llm-context/US-10504829","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:57:19.638Z"}