{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504841","patent":{"patent_number":"US-10504841","title":"Semiconductor package and method of forming the same","assignee":null,"inventors":[],"filing_date":"2018-04-18T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An embodiment method includes providing a fan-out package structure having cavities to confine semiconductor dies by applying adhesive material which has similar coefficient of thermal expansion (CTE) with semiconductor dies in the gap between the edges of dies and the edges of cavities. The method further includes forming a molding compound over a fan-out package structure with semiconductor dies, building fan-out redistribution layers over a fan-out package structure with semiconductor dies and electrically connected to the semiconductor dies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and method of forming the same","description":"An embodiment method includes providing a fan-out package structure having cavities to confine semiconductor dies by applying adhesive material which has similar coefficient of thermal expansion (CTE)","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504841","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504841","citation_suggestion":"Patentable. \"Semiconductor package and method of forming the same\" (US-10504841). https://patentable.app/patents/US-10504841","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504841","json":"https://patentable.app/api/llm-context/US-10504841","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:34:57.565Z"}