{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504850","patent":{"patent_number":"US-10504850","title":"Semiconductor processing method","assignee":null,"inventors":[],"filing_date":"2016-08-12T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":69,"abstract":"A semiconductor processing method is provided. The method includes providing a first carrier (10). A first adhesive (18) is provided on the first carrier (10) and a plurality of semiconductor chips (20) is placed on the first adhesive (18). A second carrier (28) is provided. The second carrier (28) is provided with a plurality of chip receiving areas (32). The first and second carriers (10) and (28) are then brought together to attach the semiconductor chips (20) to respective ones of the chip receiving areas (32) on the second carrier (28). The first carrier (10) is then separated from the semiconductor chips (20)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor processing method","description":"A semiconductor processing method is provided. The method includes providing a first carrier (10). A first adhesive (18) is provided on the first carrier (10) and a plurality of semiconductor chips (2","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504850","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504850","citation_suggestion":"Patentable. \"Semiconductor processing method\" (US-10504850). https://patentable.app/patents/US-10504850","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504850","json":"https://patentable.app/api/llm-context/US-10504850","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:50:58.181Z"}